IEC 61189-11:2013 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

Publication date: 7 maj 2013

General information

Current stage: 60.60 Effective date: 7 maj 2013

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180

Gjuha: anglisht frëngjisht

Buying

Statusi: Publikuar

PDF - 9 046 Lekë

Paper - 9 046 Lekë

CD - 9 046 Lekë

Language

Language in which you want to receive the document.

Scope

IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

Life cycle

NOW

PUBLISHED
IEC 61189-11:2013 ED1
60.60 Standard published
7 maj 2013