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IEC 61190-1-3:2007/AMD1:2010 ED2

Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Publication date: 10 qer 2010

General information

Current stage: 99.60 Effective date: 13 dhj 2017

Next stage: WPUB

Originator: IEC

Owner: TC 91

Type: International Standard

Gjuha: anglisht frëngjisht

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Statusi: Revised

PDF - 4 523 Lekë

Paper - 4 523 Lekë

CD - 4 523 Lekë

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PREVIOUSLY

WITHDRAWN
IEC 61190-1-3:2007 ED2

NOW

WITHDRAWN
IEC 61190-1-3:2007/AMD1:2010 ED2
99.60 Withdrawal effective
13 dhj 2017

REVISED BY

PUBLISHED
IEC 61190-1-3:2017 ED3