IEC 60191-6-5:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Publication date: 27 gush 2001

General information

Current stage: 60.60 Effective date: 27 gush 2001

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht spanjisht

Buying

Statusi: Publikuar

PDF - 4 523 Lekë

Paper - 4 523 Lekë

CD - 4 523 Lekë

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Scope

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.

Life cycle

NOW

PUBLISHED
IEC 60191-6-5:2001 ED1
60.60 Standard published
27 gush 2001

REVISED BY

ABANDON
IEC 60191-6-5 ED2