IEC 60191-6-8:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

Publication date: 27 gush 2001

General information

Current stage: 60.60 Effective date: 27 gush 2001

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht spanjisht

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Statusi: Publikuar

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Scope

IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.

Life cycle

NOW

PUBLISHED
IEC 60191-6-8:2001 ED1
60.60 Standard published
27 gush 2001