IEC 60191-6-21:2010 ED1

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

Publication date: 30 gush 2010

General information

Current stage: 60.60 Effective date: 30 gush 2010

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht

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Statusi: Publikuar

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Scope

IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

Life cycle

NOW

PUBLISHED
IEC 60191-6-21:2010 ED1
60.60 Standard published
30 gush 2010