IEC 60191-6-20:2010 ED1

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

Publication date: 30 gush 2010

General information

Current stage: 60.60 Effective date: 30 gush 2010

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht

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Statusi: Publikuar

PDF - 4 523 Lekë

Paper - 4 523 Lekë

CD - 4 523 Lekë

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Scope

IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.

Life cycle

NOW

PUBLISHED
IEC 60191-6-20:2010 ED1
60.60 Standard published
30 gush 2010