Revised
IEC 60512-9-5:2010 when required by the detail specification, is used for testing connectors within the scope of technical committee 48. It may also be used for similar devices when specified in a detail specification. The object of this standard is to detail a standard method for subjecting solderless connections to thermal stress conditioning by cyclic current loading.
WITHDRAWN
IEC 60512-9-5:2010 ED1
99.60
Withdrawal effective
9 qer 2020
PUBLISHED
IEC 60512-9-5:2020 ED2