IEC 60352-5:2008 ED3

Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance

Publication date: 10 jan 2008

General information

Current stage: 99.60 Effective date: 22 shk 2012

Originator: IEC

Owner: TC 48/SC 48B

Type: International Standard

ICS: 31.220.10

Gjuha: anglisht frëngjisht

Buying

Statusi: Revised

PDF - 28 268 Lekë

Paper - 28 268 Lekë

CD - 28 268 Lekë

Language

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Scope

Determines the suitability of press-in connections under specified mechanical, electrical and atmospheric conditions. Is applicable to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques. Changes with respect to the previous edition deal with: use of four layer test boards; sample tolerance range requirements; use of platings other than tin or tin/lead.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60352-5:2001 ED2

WITHDRAWN
IEC 60352-5:2001/AMD1:2003 ED2

NOW

WITHDRAWN
IEC 60352-5:2008 ED3
99.60 Withdrawal effective
22 shk 2012

REVISED BY

WITHDRAWN
IEC 60352-5:2012 ED4