IEC 61190-1-2:2007 ED2

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Publication date: 26 pri 2007

General information

Current stage: 99.60 Effective date: 19 shk 2014

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.190

Gjuha: anglisht frëngjisht

Buying

Statusi: Revised

PDF - 13 003 Lekë

Paper - 13 003 Lekë

CD - 13 003 Lekë

Language

Language in which you want to receive the document.

Scope

IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 61190-1-2:2002 ED1

NOW

WITHDRAWN
IEC 61190-1-2:2007 ED2
99.60 Withdrawal effective
19 shk 2014

REVISED BY

PUBLISHED
IEC 61190-1-2:2014 ED3