Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 6: Procedure for identifying and evaluating defects using a combined method of optical inspection, photoluminescence and X-ray topography
General information
10.6016 tet 2026
IEC
TC 47
International Standard
Scope
Life cycle
NOW
IN_DEVELOPMENT PNW 47-3029 ED1 10.60
Close of voting 16 tet 2026