IEC 60749-35:2006 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

Publication date: 18 korr 2006

General information

Current stage: 60.60 Effective date: 18 korr 2006

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht

Buying

Statusi: Publikuar

PDF - 17 526 Lekë

Paper - 17 526 Lekë

CD - 17 526 Lekë

Language

Language in which you want to receive the document.

Scope

Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

Life cycle

NOW

PUBLISHED
IEC 60749-35:2006 ED1
60.60 Standard published
18 korr 2006