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IEC 62047-63 ED1

Semiconductor devices - Micro-electromechanical systems - Part 63: Tensile test method for shape-memory characteristics of MEMS materials under thermomechanical loading

General information

30.99     2 tet 2026

TCDV    26 shk 2027

IEC

TC 47/SC 47F

International Standard

31.080.99  

Scope

Life cycle

NOW

IN_DEVELOPMENT
IEC 62047-63 ED1
30.99 CD approved for registration as DIS
2 tet 2026