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IEC 62047-63 ED1

Semiconductor devices - Micro-electromechanical systems - Part 63: Tensile test of shape-memory MEMS materials under elevated temperature

General information

20.99     20 shk 2026

CD    24 korr 2026

IEC

TC 47/SC 47F

International Standard

31.080.99  

Scope

Life cycle

NOW

IN_DEVELOPMENT
IEC 62047-63 ED1
20.99 WD approved for registration as CD
20 shk 2026