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PNW 91-2075 ED1

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad

General information

10.20     17 tet 2025

PRVN    9 jan 2026

IEC

TC 91

International Standard

Scope

Life cycle

NOW

IN_DEVELOPMENT
PNW 91-2075 ED1
10.20 New project ballot initiated
17 tet 2025