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IEC 60749-22-1 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - wire bond pull test methods

General information

40.00     25 tet 2024

CCDV    13 dhj 2024

IEC

TC 47

International Standard

31.080.01  

Scope

Life cycle

PREVIOUSLY

PUBLISHED
IEC 60749-22:2002 ED1

NOW

IN_DEVELOPMENT
IEC 60749-22-1 ED1
40.00 DIS registered
25 tet 2024