Revised
Applies to Universal Modular Fuse-Links (UMF) for printed circuits
and other substrate systems, used for the protection of electric
appliances, electronic equipment, and component parts thereof,
normally intended to be used indoors.
WITHDRAWN
IEC 60127-4:1989 ED1
WITHDRAWN
IEC 60127-4:1996 ED2
99.60
Withdrawal effective
27 jan 2005
WITHDRAWN
IEC 60127-4:1996/AMD2:2003 ED2
WITHDRAWN
IEC 60127-4:1996/AMD1:2002 ED2
PUBLISHED
IEC 60127-4:2005 ED3