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IEC 63609-1 ED1

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 1: Guideline for thermal design of applications where the heat dissipation path to the board is dominant

General information

30.99     24 pri 2026

TCDV    30 tet 2026

IEC

TC 91

International Standard

31.180     31.190  

Scope

Life cycle

NOW

IN_DEVELOPMENT
IEC 63609-1 ED1
30.99 CD approved for registration as DIS
24 pri 2026