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IEC 63609-1 ED1

Measurement method used in thermal design for electronics assemblies - Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized SMDs where the heat dissipation path to the board is dominant

General information

20.99     25 tet 2024

CD    31 tet 2025

IEC

TC 91

International Standard

31.180     31.190  

Scope

Life cycle

NOW

IN_DEVELOPMENT
IEC 63609-1 ED1
20.99 WD approved for registration as CD
25 tet 2024