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IEC 63609-1 ED1

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 1: Guideline for thermal design of applications where the heat dissipation path to the board is dominant

General information

30.60     2 jan 2026

IEC

TC 91

International Standard

31.180     31.190  

Scope

Life cycle

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IN_DEVELOPMENT
IEC 63609-1 ED1
30.60 Close of voting/ comment period
2 jan 2026