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IEC 61189-3-303 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boards

General information

30.99     30 jan 2026

TCDV    27 mar 2026

IEC

TC 91

International Standard

31.180  

Scope

Life cycle

NOW

IN_DEVELOPMENT
IEC 61189-3-303 ED1
30.99 CD approved for registration as DIS
30 jan 2026