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IEC 61189-3-303 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boards

General information

40.00     23 tet 2026

CCDV    11 dhj 2026

IEC

TC 91

International Standard

31.180  

Scope

Life cycle

NOW

IN_DEVELOPMENT
IEC 61189-3-303 ED1
40.00 DIS registered
23 tet 2026