IEC 60749-34:2004 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

Publication date: 10 mar 2004

General information

Current stage: 99.60 Effective date: 28 tet 2010

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht spanjisht

Buying

Statusi: Revised

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CD - 4 523 Lekë

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Scope

Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC PAS 62206:2000 ED1

NOW

WITHDRAWN
IEC 60749-34:2004 ED1
99.60 Withdrawal effective
28 tet 2010

REVISED BY

PUBLISHED
IEC 60749-34:2010 ED2