IEC 61760-1 ED4

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

Scope

IEC 61760-1 ED4 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that are included in any SMD component’s general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology.
Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board, including solderless interconnection technology. Cases for which this is appropriate are indicated in the relevant subclauses.
NOTE Solderless interconnection technology refers to a mounting method which is not part of the surface-mounting process and the components do not undergo a soldering operation. Such components are included in this document because the mounting of components for solderless interconnection commonly occurs after the mounting of SMDs.
This edition includes the following significant technical changes with respect to the previous edition:
a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection.