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PWI 47D-8 ED1

Thermal standardization on semiconductor packages – Part 7: Background and glossary of Thermal Simulation and Compact Thermal Models on Semiconductor Packaging

General information

Current stage: 00.00 Effective date: 13 jan 2023

Next stage: PREPNW Next stage date: 12 jan 2024

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

Scope

Life cycle

NOW

IN_DEVELOPMENT
PWI 47D-8 ED1
00.00 Proposal for new project received
13 jan 2023

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