IEC 63378-2-1:2024 ED1

Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages

Publication date: 22 tet 2024

General information

Current stage: 60.60 Effective date: 22 tet 2024

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht

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Statusi: Publikuar

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Scope

IEC 63378-2-1:2024 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.
This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.

Life cycle

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PUBLISHED
IEC 63378-2-1:2024 ED1
60.60 Standard published
22 tet 2024