IEC 60749-3:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection

Publication date: 9 pri 2002

General information

Current stage: 99.60 Effective date: 3 mar 2017

Next stage: WPUB

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht spanjisht

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Statusi: Revised

PDF - 1 131 Lekë

Paper - 1 131 Lekë

CD - 1 131 Lekë

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Scope

Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.

The contents of the corrigendum of August 2003 have been included in this copy.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

WITHDRAWN
IEC PAS 62163:2000 ED1

NOW

WITHDRAWN
IEC 60749-3:2002 ED1
99.60 Withdrawal effective
3 mar 2017

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60749-3:2002/COR1:2003 ED1

REVISED BY

PUBLISHED
IEC 60749-3:2017 ED2