Replaced
Verifies that the markings on solid state semiconductor devices will not become illegible when subjected to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process.
WITHDRAWN
IEC PAS 62175:2000 ED1
95.99
Withdrawal of Standard
1 korr 2002
WITHDRAWN
IEC 60749-9:2002 ED1