IEC PAS 62174:2000 ED1

Resistance to soldering temperature for through-hole mounted devices

Publication date: 22 gush 2000

95.99 Withdrawal of Standard 31 mar 2003

General information

Current stage: 95.99 Effective date: 31 mar 2003

Originator: IEC

Owner: TC 47

Type: Publicly Available Specification

ICS: 31.080.01

Gjuha: anglisht

Buying

Statusi: Replaced

PDF - 2 261 Lekë

Paper - 2 261 Lekë

CD - 2 261 Lekë

Language

Language in which you want to receive the document.

Scope

Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.

Life cycle

NOW

WITHDRAWN
IEC PAS 62174:2000 ED1
95.99 Withdrawal of Standard
31 mar 2003

REVISED BY

WITHDRAWN
IEC 60749-15:2003 ED1