IEC 61189-2-808:2024 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

Publication date: 25 pri 2024

General information

Current stage: 60.60 Effective date: 25 pri 2024

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180

Gjuha: anglisht frëngjisht

Buying

Statusi: Publikuar

PDF - 13 003 Lekë

Paper - 13 003 Lekë

CD - 13 003 Lekë

Language

Language in which you want to receive the document.

Scope

IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.

Life cycle

NOW

PUBLISHED
IEC 61189-2-808:2024 ED1
60.60 Standard published
25 pri 2024

National adoptions

prSSH EN IEC 61189-2-808:2024

DPS

Metodat e provës për materialet elektrike, pllakat e printuara dhe strukturat dhe montimet e tjera të ndërlidhjes - Pjesa 2-808: Rezistenca termike e një montimi me metodën kalimtare termike

40.60 Close of voting

DPS/KT 8 më tepër