IEC TR 62878-2-7:2019 ED1

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

Publication date: 20 mar 2019

General information

Current stage: 60.60 Effective date: 20 mar 2019

Originator: IEC

Owner: TC 91

Type: Technical Report

ICS: 31.180 31.190

Gjuha: anglisht

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Statusi: Publikuar

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Scope

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

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PUBLISHED
IEC TR 62878-2-7:2019 ED1
60.60 Standard published
20 mar 2019