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IEC 60512-6-2:2002 ED1

Connectors for electronic equipment - Tests and measurements - Part 6-2: Dynamic stress tests - Test 6b: Bump
21 shk 2002

General information

60.60     21 shk 2002

IEC

TC 48/SC 48B

International Standard

31.220.10  

anglisht   frëngjisht   spanjisht  

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Scope

Defines a standard test method to assess the ability of components (essentially connectors) to withstand specified severities of bump.

Life cycle

NOW

PUBLISHED
IEC 60512-6-2:2002 ED1
60.60 Standard published
21 shk 2002