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IEC 60068-2-69:2017/AMD1:2019 ED3

Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
19 qer 2019

General information

60.60     19 qer 2019

IEC

TC 91

International Standard

19.040     31.190  

anglisht   frëngjisht  

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IEC 60068-2-69:2017 ED3

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PUBLISHED
IEC 60068-2-69:2017/AMD1:2019 ED3
60.60 Standard published
19 qer 2019