Standardizimi mekanik i pajisjeve gjysmëpërçuese - Rregulla të përgjithshme për përgatitjen e vizatimeve konturuese të paketave të pajisjes gjysmëpërçuese të montuar në sipërfaqe - Pjesa 6 - 2: Udhëzues projekti për sferën e imët 1.50 mm. 1.27 mm dhe 1.00
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball and column terminal packages.
Life cycle
NOW
PUBLISHED SSH EN 60191-6-2:2002 60.60
Standard published 1 jan 2004
Related project
Adopted from
EN 60191-6-2:2002
Adopted from
IEC 60191-6-2 Ed. 1.0 en
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