DPS
Drejtoria e Përgjithshme e Standardizimit
0 Items
My account
E-albania
Phone: +355 4 222 62 55
E-mail: info@dps.gov.al
Address: Address: "Reshit Collaku" Str., (nearby ILDKPKI, VI floor), Po.Box 98, Tiranë - Albania
Main menu

IEC 62047-16:2015 ED1

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

Mar 5, 2015

General information

60.60     Mar 5, 2015

IEC

TC 47/SC 47F

International Standard

31.080.99  

English   French  

Buying

Published

Language in which you want to receive the document.

Scope

IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.

Life cycle

NOW

PUBLISHED
IEC 62047-16:2015 ED1
60.60 Standard published
Mar 5, 2015