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IEC 60749-22-2 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods

General information

50.00     Jul 28, 2025

CFDIS    Oct 20, 2025

IEC

TC 47

International Standard

31.080.01  

Life cycle

PREVIOUSLY

PUBLISHED
IEC 60749-22:2002 ED1

NOW

IN_DEVELOPMENT
IEC 60749-22-2 ED1
50.00 Final text received or FDIS registered for formal approval
Jul 28, 2025