IEC 60749-22:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Publication date: Sep 12, 2002

General information

Current stage: 60.60 Effective date: Sep 12, 2002

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Languages: English French Spanish

Buying

Status: Published

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Paper - ALL 16,960

CD - ALL 16,960

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Scope

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

NOW

PUBLISHED
IEC 60749-22:2002 ED1
60.60 Standard published
Sep 12, 2002

CORRIGENDA / AMENDMENTS

PUBLISHED
IEC 60749-22:2002/COR1:2003 ED1

REVISED BY

IN_DEVELOPMENT
IEC 60749-22-1 ED1

IN_DEVELOPMENT
IEC 60749-22-2 ED1