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IEC 60749-22:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

General information

99.60     Nov 26, 2025

IEC

TC 47

International Standard

31.080.01  

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749-22:2002 ED1

NOW

WITHDRAWN
IEC 60749-22:2002/COR1:2003 ED1
99.60 Withdrawal effective
Nov 26, 2025