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SSH EN 60749-9:2002

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

Dec 18, 2006
95.99 Withdrawal of Standard   Mar 10, 2025

General information

95.99     Mar 10, 2025

DPS

DPS/KT 4

European Norm

31.080.01  

English  

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Scope

Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive.

Life cycle

NOW

WITHDRAWN
SSH EN 60749-9:2002
95.99 Withdrawal of Standard
Mar 10, 2025

REVISED BY

PUBLISHED
SSH EN 60749-9:2017

Related project

Adopted from EN 60749-9:2002

Adopted from IEC 60749-9:2002 ED1