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IEC 60749-9:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

Apr 12, 2002

General information

99.60     Mar 3, 2017

WPUB   

IEC

TC 47

International Standard

31.080.01  

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Revised

Language in which you want to receive the document.

Scope

Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process.
This test is applicable for all package types. The test should be considered non-destructive.

The contents of the corrigendum of August 2003 have been included in this copy.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

WITHDRAWN
IEC PAS 62175:2000 ED1

NOW

WITHDRAWN
IEC 60749-9:2002 ED1
99.60 Withdrawal effective
Mar 3, 2017

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60749-9:2002/COR1:2003 ED1

REVISED BY

PUBLISHED
IEC 60749-9:2017 ED2