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Drejtoria e Përgjithshme e Standardizimit

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SSH EN 60191-6-4:2003

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Publication date: Dec 18, 2006

General information

Current stage: 60.60 Effective date: Jan 1, 2006

Originator: DPS

Owner: DPS/KT 4

Type: European Norm

Languages: English

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Status: Published

PDF - ALL 3,094

Paper - ALL 3,094

CD - ALL 3,094

PDF and Paper - ALL 6,188

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Scope

Covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

Life cycle

NOW

PUBLISHED
SSH EN 60191-6-4:2003
60.60 Standard published
Jan 1, 2006

Related project

Adopted from EN 60191-6-4:2003

Adopted from IEC 60191-6-4 Ed. 1.0 en