IEC 60068-2-83:2025 is available as IEC 60068-2-83:2025 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 60068-2-83:2025 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste. Data obtained by these methods are not intended to be used as absolute quantitative data for pass/fail purposes.
NOTE Different solderability test methods for SMD are described in IEC 60068‑2‑58 and IEC 60068‑2‑69. IEC 60068‑2‑58 specifies visual evaluation using solder bath and reflow method, IEC 60068‑2‑69 specifies wetting balance evaluation using solder bath and solder globule method.
This edition includes the following significant technical change with respect to the previous edition:
a) revise Clause 5 to align with that in IEC 60068‑2‑20:2021.
PUBLISHED
SSH EN 60068-2-83:2011
IN_DEVELOPMENT
prSSH EN IEC 60068-2-83:2025
40.20
DIS ballot initiated: 12 weeks
Feb 9, 2026
Only informative sections of projects are publicly available. To view the full content, you will need to create an account. If you are a member, please log in to your account by clicking on the "Log in" button.
Shqip