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IEC 60068-2-83 ED2

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

General information

40.60     Nov 22, 2024

IEC

TC 91

International Standard

19.040     31.190  

Life cycle

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PUBLISHED
IEC 60068-2-83:2011 ED1

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IN_DEVELOPMENT
IEC 60068-2-83 ED2
40.60 Close of voting
Nov 22, 2024