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SSH EN 62047-25:2016

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

Apr 13, 2017

General information

60.60     Feb 2, 2017

DPS

DPS/KT 7

European Norm

31.080.99  

English  

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Scope

IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.

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PUBLISHED
SSH EN 62047-25:2016
60.60 Standard published
Feb 2, 2017

Related project

Adopted from EN 62047-25:2016

Adopted from IEC 62047-25 Ed. 1.0 b