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SSH EN 60749-3:2002

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

Dec 18, 2006
95.99 Withdrawal of Standard   Apr 19, 2023

General information

95.99     Apr 19, 2023

DPS

DPS/KT 4

European Norm

31.080.01  

English  

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Scope

Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.

Life cycle

NOW

WITHDRAWN
SSH EN 60749-3:2002
95.99 Withdrawal of Standard
Apr 19, 2023

REVISED BY

PUBLISHED
SSH EN 60749-3:2017

Related project

Adopted from EN 60749-3:2002

Adopted from IEC 60749-3 Ed. 1.0 b