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SSH EN 60191-6-6:2001

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

Jun 20, 2005

General information

60.60     Jan 1, 2005

DPS

DPS/KT 304

European Norm

31.080.01  

English  

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Scope

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

Life cycle

NOW

PUBLISHED
SSH EN 60191-6-6:2001
60.60 Standard published
Jan 1, 2005

Related project

Adopted from EN 60191-6-6:2001

Adopted from IEC 60191-6-6 Ed. 1.0 en