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SSH EN 61190-1-3:2002

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Jan 1, 2006
95.99 Withdrawal of Standard   Mar 17, 2014

General information

95.99     Mar 17, 2014

DPS

DPS/KT 4

European Norm

31.190  

English  

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Scope

Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Life cycle

NOW

WITHDRAWN
SSH EN 61190-1-3:2002
95.99 Withdrawal of Standard
Mar 17, 2014

REVISED BY

PUBLISHED
SSH EN 61190-1-3:2007

Related project

Adopted from EN 61190-1-3:2002