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IIoT applications in power distribution systems management: Architecture and functional requirements
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Guideline for the planning and design of direct current or hybrid microgrids
30.60 Close of voting/ comment period
LED light source characteristics - Part 1: Data sheets
60.00 Standard under publication
Fluids for electrotechnical application: Specifications for the re-use of mixtures of gases alternative to SF<sub>6</sub>
50.00 Final text received or FDIS registered for formal approval
Performance of voltage sourced converter (VSC) based high-voltage direct current (HVDC) transmission - Part 2: Transient conditions
30.20 CD study/ballot initiated
Semiconductor devices - Semiconductor devices for IoT system - Part 2: Test method of semiconductor photon sources incorporating human factors for wearable equipment
30.20 CD study/ballot initiated
Carbon footprint calculation applicable to industrial lithium-ion batteries - Part 1: General requirements and methodology
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Materials used in photovoltaic (PV) cells - Part 1: Specifications for electrical characteristics of crystalline silicon wafers
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Quantification and communication of carbon footprint, GHG emission reductions and avoided emissions from electric and electronic products and systems - Principles, methodologies, requirements and guidance (Proposed horizontal publication)
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages
30.99 CD approved for registration as DIS
Thermal standardization on semiconductor packages - Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages
30.99 CD approved for registration as DIS
Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
60.00 Standard under publication
Thermal standardization on semiconductor packages - Part 6-1: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a datasheet of semiconductor device
40.20 DIS ballot initiated: 12 weeks
Vehicle connector, vehicle inlet and cable assembly for Megawatt DC charging
50.60 Close of voting. Proof returned by secretariat
<p>Standard Interface for Connecting Charging stations to Local Energy Management Systems - Part-4 Test Specifications</p>
20.99 WD approved for registration as CD
Management of distributed energy storage systems based on electrically chargeable vehicle batteries - Part 1: Use cases and architectures
60.00 Standard under publication
Management of Distributed Energy Storage Systems based on Electrically Chargeable Vehicles (ECV-DESS) - Part 2: Data models Protocols, Messages
20.99 WD approved for registration as CD
Management of Distributed Energy Storage Systems based on Electrically Chargeable Vehicles (ECV-DESS) - Part 3: Conformance tests
20.99 WD approved for registration as CD
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