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Calculation of load capacity of spur and helical gears — Part 21: Calculation of scuffing load capacity — Integral temperature method
60.60 Standard published
Calculation of load capacity of spur and helical gears — Part 22: Calculation of micropitting load capacity
60.60 Standard published
Calculation of load capacity of spur and helical gears — Part 3: Calculation of tooth bending strength
60.60 Standard published
Calculation of load capacity of spur and helical gears — Part 30: Calculation examples for the application of ISO 6336 parts 1,2,3,5
60.60 Standard published
Calculation of load capacity of spur and helical gears — Part 31: Calculation examples of micropitting load capacity
60.60 Standard published
Calculation of load capacity of spur and helical gears — Part 4: Calculation of tooth flank fracture load capacity
60.60 Standard published
Calculation of load capacity of spur and helical gears — Part 5: Strength and quality of materials
60.60 Standard published
Calculation of load capacity of spur and helical gears — Part 6: Calculation of service life under variable load
60.60 Standard published
Fluids for electrotechnical application - Specification of gases alternative to SF6 to be used in electrical power equipment
60.60 Standard published
Application of fixed capacitors in electronic equipment - Part 1: Aluminium electrolytic capacitors
60.60 Standard published
Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection
60.60 Standard published
Industrial process measurement, control and automation - Digital nameplate
60.60 Standard published
Dynamic on-resistance test method guidelines for GaN HEMT based power conversion devices
60.60 Standard published
Industrial facility energy management system (FEMS) - Functions and information flows
60.60 Standard published
Procedures for the assessment of human exposure to electromagnetic fields from radiative wireless power transfer systems – Measurement and computational methods (frequency range of 30 MHz to 300 GHz)
60.60 Standard published
Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
60.60 Standard published
Cybersecurity aspects of devices used for power metering and monitoring, power quality monitoring, data collection and analysis
60.60 Standard published
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