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Amendment 1 - Radio-frequency connectors. Part 7: R.F. coaxial connectors with inner diameter of outer conductor 9.5 mm (0.374 in) with bayonet lock - Characteristic impedance 50 ohms (Type C)
60.60 Standard published
Radio-frequency connectors. Part 9: R.F. coaxial connectors with inner diameter of outer conductor 3 mm (0.12 in) with screw coupling - Characteristic impedance 50 ohms (Type SMC)
60.60 Standard published
Amendment 1 - Radio-frequency connectors. Part 9: R.F. coaxial connectors with inner diameter of outer conductor 3 mm (0.12 in) with screw coupling - Characteristic impedance 50 ohms (Type SMC)
60.60 Standard published
Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires
60.60 Standard published
Aerospace series - Test methods for metallic materials - Determination of density according to displacement method
60.60 Standard published
High-pressure mercury vapour lamps - Performance specifications
60.60 Standard published
High-pressure mercury vapour lamps - Performance specifications
60.60 Standard published
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
60.60 Standard published
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
60.60 Standard published
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
60.60 Standard published
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
60.60 Standard published
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
60.60 Standard published
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
60.60 Standard published
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
60.60 Standard published
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
60.60 Standard published
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
60.60 Standard published
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
60.60 Standard published
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
60.60 Standard published
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