Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
Life cycle
NOW
PUBLISHED SSH EN 60191-6-17:2011 60.60
Standard published Nov 25, 2011
Related project
Adopted from
EN 60191-6-17:2011
Adopted from
IEC 60191-6-17 Ed. 1.0 b
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