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IEC 62137:2004 ED1

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Jul 6, 2004

General information

99.60     Oct 9, 2014

IEC

TC 91

International Standard

31.190  

English   French  

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Scope

This International Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages.
This standard tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits (hereinafter both referred to as semiconductor devices) used mainly for industrial and consumer use equipment.

Life cycle

NOW

WITHDRAWN
IEC 62137:2004 ED1
99.60 Withdrawal effective
Oct 9, 2014

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 62137:2004/COR1:2005 ED1

REVISED BY

PUBLISHED
IEC 62137-4:2014 ED1