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IEC 62137:2004/COR1:2005 ED1

Corrigendum 1 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

General information

99.60     Oct 9, 2014

IEC

TC 91

International Standard

31.190  

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 62137:2004 ED1

NOW

WITHDRAWN
IEC 62137:2004/COR1:2005 ED1
99.60 Withdrawal effective
Oct 9, 2014

REVISED BY

PUBLISHED
IEC 62137-4:2014 ED1