IEC 60127-4:2005 ED3

Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types

Publication date: Dec 7, 2012

General information

Current stage: 60.60 Effective date: Jan 27, 2005

Originator: IEC

Owner: TC 32/SC 32C

Type: International Standard

ICS: 29.120.50

Languages: English French

Buying

Status: Published

PDF - ALL 33,921

Paper - ALL 33,921

CD - ALL 33,921

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Scope

This part of IEC 60127 relates to universal modular fuse-links (UMF) for printed circuits and other substrate systems, used for the protection of electric appliances, electronic equipment, and component parts thereof, normally intended to be used indoors. It does not apply to fuse-links for appliances intended to be used under special conditions, such as in a corrosive or explosive atmosphere. This standard applies in addition to the requirements of IEC 60127-1.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60127-4:1996 ED2

WITHDRAWN
IEC 60127-4:1996/AMD2:2003 ED2

WITHDRAWN
IEC 60127-4:1996/AMD1:2002 ED2

NOW

PUBLISHED
IEC 60127-4:2005 ED3
60.60 Standard published
Jan 27, 2005

CORRIGENDA / AMENDMENTS

PUBLISHED
IEC 60127-4:2005/AMD1:2008 ED3

PUBLISHED
IEC 60127-4:2005/AMD2:2012 ED3

REVISED BY

IN_DEVELOPMENT
IEC 60127-4 ED4