IEC 60127-4 ED4

Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types

General information

Current stage: 50.20 Effective date: Nov 21, 2025

Next stage: PRVD Next stage date: Jan 2, 2026

Originator: IEC

Owner: TC 32/SC 32C

Type: International Standard

ICS: 29.120.50

Scope

This part of IEC 60127 relates to universal modular fuse-links (UMF) for printed circuits and other substrate systems, used for the protection of electric appliances, electronic equipment, and component parts thereof, normally intended to be used indoors.

Life cycle

PREVIOUSLY

PUBLISHED
IEC 60127-4:2005 ED3

PUBLISHED
IEC 60127-4:2005/AMD1:2008 ED3

PUBLISHED
IEC 60127-4:2005/AMD2:2012 ED3

NOW

IN_DEVELOPMENT
IEC 60127-4 ED4
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Nov 21, 2025

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